Increasing Power Density Consider Packaging and Silicon - Technical Articles
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Example of bond-wire and clip-lead power SOP-8 leaded packages. | Download Scientific Diagram
a) Cu wire bonds on an IGBT [9], (b) a DCB substrate with Al ribbons... | Download Scientific Diagram
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging - ScienceDirect
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Example of bond-wire and clip-lead power SOP-8 leaded packages. | Download Scientific Diagram
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Structure diagram of Cu clip bonding package. | Download Scientific Diagram
Electronics | Free Full-Text | Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters